| Product Code | Chemical Name | Features and Advantages | Applications |
|---|---|---|---|
| LE-PD | Phosphoric Acid (Electronic Grade) | Molecular Formula: H3PO4 | Used to remove Silicon Nitride layers in semiconductor production. |
| LE-SA | Sulfuric Acid (Electronic Grade) | Molecular Formula: H2SO4 | Used to as an ingredient of detergent or etchant in semiconductor production. |
| LE-DP | Developer | Molecular Formula: C4H13NO / (CH3)4NOH | Used to remove the organic residues of exposed PR and to show the PR pattern. |
| LE-10 |
Stripper Monoethanol amine(MEA); Diethylene glycol monobutyl ether(BDG); N,N-Dimethyl Acetamide(DMAC); |
Process chemicals, wet chemicals | Used to remove the PR after etching process to show the circuit pattern. |
| LE-11 | Etchant | Process chemicals, wet chemicals | Different acids or their blend according to the natures of target thin film. Used for etching the certain part of thin film. Etchants are approximately of Oxalic acid dihydrate. Used to etch the amorphous ITO layers. Aqua Regia A mixture of hydrochloric acid and nitric acid, to be used to etch crystalline ITO layers. Al Etchant A mixture of multiple acids, to be use to etch the Al layers. |
| LE-DMSO | Dimethyl Sulfoxide(DMSO) |
Molecular Formula: C2H6OS / CH3SOCH3 Very important aprotic polar solvents soluble in both water and organic solvents. Widely used as solvent and reaction reagent, it has high selective extraction ability. |
Used as a common solvent for many chemical reactions and in organic synthesis and industrial applications (polymer chemistry, pharmaceutical and agricultural chemicals). In organic synthesis, dimethyl sulfoxide can be used in many oxidation reactions, in production and manufacture of microelectronics industry; in medicine, dimethyl sulfoxide is mainly used in local analgesics, local drug carriers, anti-inflammatory drugs and antioxidants. |
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